Number of fpc soft board layers: 6L
Structure: 2R 2F 2R
Plate thickness: 1.0mm
Outer copper thickness: 1 OZ
Inner copper thickness: 1 OZ
Minimum hole diameter: 0.3mm
Minimum line width/line spacing: 3mil
Surface treatment: gold deposit
Product use: high Bluetooth headset
Process difficulty: strict impedance matching requirements