PCB proofing As the carrier of electronic components, the size and performance of the circuit board are determined by the number of layers of the multilayer board and the precision design degree of the circuit. This industrial robot adopts an 8-layer board design, with 3 mi l/3 mi l line width and line matching. At the same time, it encapsulates 10 groups of ICs and 12 groups of BGAs, which can be called a high-end product of high-precision printed circuit boards.

Main Process Characteristics of PCB Proofing Embedded Blind Orifice

1. Design of buried blind hole;

2. 3mil line width and line spacing;

3. BGA spherical design shall be uniform in size;

4. IC green oil bridge 4mil/4mil.