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High frequency communication pcb layer: 16L
Plate thickness: 1.6mm
Outer copper thickness: H OZ
Inner copper thickness: H OZ
Minimum hole diameter: 0.15 mm
Minimum line width/line spacing: 3mil
Surface treatment: gold deposit
Product application: communication motherboard
Process difficulties: high and multi-layer
Contact: Mr. Zheng
Mobile phone: 13544145687
Tel.: 0755-23504156
Email: gypcb68@163.com
Website: www.gydcpcb.com
Address of Shenzhen Marketing Department: B212, Yinong Building, No. 4, Haoye Road, Qiaotou Community, Fuhai Street, Bao'an District, ShenzhenAddress of Chengdu Marketing Department: 14/F, Building B, Zijingnian, No. 5, Chuangye Road, High tech Zone, Chengdu, SichuanFactory address: Building 4, Wansha Industrial Park, Gonghe Village, Shajing Street, Bao'an District, Shenzhen
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