It is understood that the global communication PCB market will reach 14.799 billion US dollars in 2016, accounting for 27.3% of the total output of PCB. Among them, the proportions of single-sided, double-sided, 4-layered, 6-layered, 8-16-layered and over 18 years old were 11.98%, 17.62%, 12.49%, 35.18% and 7.26% respectively, with the total proportion reaching 84.5%. In 2014, due to the construction of 4G base stations, the output value of global communication printed circuit boards increased by 5.18% year on year, reaching the highest level in four years. 5G will be commercialized in 2019. Thanks to 5G, the future communication printed circuit board is expected to usher in a new round of rapid growth.

According to insiders, among 5G wireless base stations, operator networks, transmission networks and core network hardware facilities, PCB hardware applications will increase significantly. At the same time, 5G terminal devices, such as mobile phones and smart watches, should also be updated simultaneously with communication technology, which requires much more circuit boards than infrastructure.