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10 layer gold deposition communication pcb layer number: 10 L
Plate thickness: 2.0mm
Outer copper thickness: 1 OZ
Inner copper thickness: 1 OZ
Minimum hole diameter: 0.3mm
Minimum line width/line spacing: 4mil
Surface treatment: gold deposit
Product application: Micro base station motherboard
Process difficulty: high multilayer structure
Contact: Mr. Zheng
Mobile phone: 13544145687
Tel.: 0755-23504156
Email: gypcb68@163.com
Website: www.gydcpcb.com
Address of Shenzhen Marketing Department: B212, Yinong Building, No. 4, Haoye Road, Qiaotou Community, Fuhai Street, Bao'an District, ShenzhenAddress of Chengdu Marketing Department: 14/F, Building B, Zijingnian, No. 5, Chuangye Road, High tech Zone, Chengdu, SichuanFactory address: Building 4, Wansha Industrial Park, Gonghe Village, Shajing Street, Bao'an District, Shenzhen
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